Printed circuit board identification
Printed circuit boards are put under various processes within the operating schedule and product life cycle and the labelling of a printed circuit board can happen during several phases within the production chain. Thereby the spectrum of possibilites to printed circuit board identification is very extensive.
When the labelling of the printed board circuit happens at the beginning of the production chain, most of the time a very significant label (e.g. polyimide or acrylate film) is necessary, so that the special cleaning- and brazing processes can be conducted. In this stage aggressive chemicals can be used and high temperatures appeal on the printed curcuit boards. Additionaly a high degree of mechanical stability must be complied. Here special requirements must be fulfilled, as well at the label material (casted films are preferred due to their stability of dimension), to the adhesive (durability of warmth), as well as the surface/ printing (mechanical or thermal).
Additionally the identification respectively the spending happens automated. So the label must be spendable perfectly, that means it must be released from the liner very easy, but at once must adhere good, quick and thermal stabil at the printed circuit board. Therefore an exact setting on the sandwich panel liner material - adhesive - labelmaterial is necessary.
When the identification of the printed circuit board happens after the assembly and the brazing process, mostly a simple PET-material with a standard adhesive is adequate.
A good identification of a printed cicruit board is nessecary in the whole production process. Started from the import of the products in the manufacturing process, across the later installation in superior assembly groups, to the general quality management up to the general traceability of printed circuit boards in their life cycle